ASIC Testing & Qualification
From wafer-level to packaged chip, Microtest’s full-stack testing service brings together precision, reliability and experience inside their own controlled test houses and global network.
What sets Microtest’s ASIC Testing & Qualification services apart:
- Complete Wafer Sorting (WS) – performing high-precision wafer sorting with their advanced in house probing systems to identify functional die at scale early in the production chain
- Robust Final Testing (FT) – once packaged, your ASICs recive thorough functional validation through specialized handlers, ensuring quality performance under realistic operating conditions
- Rigorous Characterization & Qualification – in depth device performance analysis with existing tests (functional, scan, power consumption and absolute ratings), and conduct reliability testing, including burn-in and HTOL, to ensure longevity and consistency for your ASICs
- Failure & Technology Analysis (FTA) – if an ASIC dosen’t perform as expected, deep-dive investigation into failures and yield challanges ensures clear insight on where the problem arised in order to ensure long-term device reliability and refined product maturity
- Turn-Key Test House Infrastructure – Microtest runs its own state-of-the-art test facilities across the globe with locations in Italy, Germany, Malaysia and beyond, offering turn-key solutions from characterization to mass-production
- Smart Process Design (DFT) – by combining smart design methodologies with turn-key solutions, our team optimizes your ASICs architecture for cost-effective, high-yield production
